Samsung announces new 3G chipset

Sep 07 2004 - 02:50 AM ET | 3G, Samsung
Samsung has announced a new 3G chipset with a record breaking amount of built in storage--up to 2.5 Gigabits. The four-die multi-chip package (MCP) should allow for more complex 3G phones while maintaining healthy battery life: bq. By combining more multimedia data storage at a low power consumption rate, this MCP offers cell phone designers the ability to add new functionality to next generation mobile phones without sacrificing space or performance... The new device operates on as little as 1.8 volts, yet can fully support the transmission of quarter video graphics array (QVGA) quality video for up to four hours of video data.